wafer segment diamond blades
Payment Terms: |
T/T,L/C,WU;PAYPAL |
Place of Origin: |
Shanghai, China (Mainland) |
Product Detail
Means of Transport:
Ocean,Land,Air;EXPRESS
Packing:
boxes
Production Capacity:
1000000
Delivery Date:
one week
The wafer segment blade help the user to achieve smooth and fast cutting in ceramic, tile, porcelain and glazed tile, and for dry application
Main feature: fast speed and steady cutting with better smoothness and no damage to the edge, good chip removal......
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